EPOXYSET Inc.: Potting Compound | Adhesives & Sealants Industry
EC-1015HP epoxy potting compound from epoxySet Inc. is a heat-cure system designed for temperature cycling from -55 to 180 °C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. The low CTE of 34 ppm/°C also keeps the […]