The RS8 Airless Pump Filler from ProSys Fill LLC operates at speeds of up to 35 airless pumps per minute and features a compact eight-station indexing dial designed for maximum efficiency and versatility, enabling the seamless filling and closing of a wide range of pump styles and sizes up to two inches in diameter. This […]
As industries evolve toward tighter tolerances and higher-performance bonding systems, the spotlight is turning to an often overlooked aspect of adhesive technology: packaging. Nowhere is this more evident than in the rise of two-component (2K) adhesives, where packaging precision directly impacts the effectiveness of the product. While dual-component systems offer superior performance characteristics — such […]
Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. CIP 35E is designed to be an alternative to hard-curing dispensable materials but also provide an improvement over standard application methods associated with thermal gap filler pads. As a two-component dispensable material, it has an […]
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