DELO: Adhesive for Semiconductor Miniaturization
A new adhesive that can be used to create ultra-fine structures within seconds, DELO DUALBOND EG4797 is creating new possibilities in heterogeneous integration and optical packaging applications. Able to realize unlimited freeform structures and razor-thin optical barriers, the material also answers to the ongoing trend towards miniaturization. The halogen- and solvent-free acrylate allows for extremely […]