THERM-A-GAP GEL 75VT from Parker Chomerics is a reworkable, one-component silicone thermal interface gel with a 7.5 W/m-K thermal conductivity. The product was developed for vertical and high-vibration applications and offers reliable heat conduction from electronics to heat sinks or enclosures. It requires no mixing or secondary curing, making it easy to apply and rework, […]
Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. CIP 35E is designed to be an alternative to hard-curing dispensable materials but also provide an improvement over standard application methods associated with thermal gap filler pads. As a two-component dispensable material, it has an […]
Thermally conductive or flame-retardant thermosets have a long history in the thermoset industry. New applications like gap fillers or battery housings for lithium-ion batteries (LiB) drive the trend towards higher filling levels. In classic thermal conductive applications filler loads of 70-75 wt.-% can be obtained comparably easily, while in gap fillers for batteries filling levels […]
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